Product Description
Auto-leveling & Larger Build Volume
●Using inductive leveling to save you time and reduce printing error tips, making 3d printing a breeze.
●The build volume is up to 310*310*340mm. There is more room to create, can print medium-sized models
Upgraded Structure Design
Modular design makes the assembly easier and more convenient. Structure design is refined to increase the stability, taking printing accuracy to a new level.
Silent Printing
German TMC silent driver, which ensures stable operation and faster heat dissipation. Dual cooling fan system that can quickly cool down the printpart and the nozzle with strong cooling and less noise.
Power Loss Recovery
Blackout occurred? No worries-B1 SE Plus can deal with that. The printer can fully recover from the loss of power and continue printing exactly where it left off.
Filament Runout Detection
The printing will stop automatically when the filament runs out. lt will resume printing after reloading the filament.
Powerful 32 Bit Control Board
●Packs a 32-bit ARM Cortex-M4 series main control chip that delivers a powerful performance and faster processing speed.
● Extensive expansion interfaces. Support Raspberry Pi, wifi module, bl touch, RGB light, etc.
Aluminum Extruder & Premium Brass Nozzle
Durable aluminum extruder and high-quality brass nozzle with inner surface Ra0.4 ensures smooth flament loading and retraction.
HD Color Touch Screen
3.5 inch Touch Screen with responsive touch control and smooth operation. Support for languages switching.
Upgraded Heatbed
Aluminum-based heatbed reinforces the thickness of 1mm,which featureshigh hardness and better flatness.
Dimensions & Specs
3D Printer Name
BIQU B1 SE Plus
Molding Tech
FDM
Nozzle Diameter
Standard 0.4mm
Firmware
Marlin
Slicing Software Compatibility
Cura/Repetier-Host/Simplify 3D...
Output Voltage
24V
Related Power
300W
Max Printing Speed
120mm/s
Normal Printing Speed
60mm/s
Build Volume
310x310x340mm
Layer Thickness
0.1mm-0.3mm
Printing Accuracy
±0.05mm
File Format
G-code
Printing Method
Online/ TF Card/ USB
Rated Voltage
100-120V /200-240V 50/60 Hz
Max Temperature of Heated Bed
100℃
Maximum Temperature of Nozzle
260℃
Filament
PLA/PETG/TPU/TPE/ABS/Nylon
Packaging List
Upgradeable Hardware
